ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/high-strain-rate?con=t&page=2
. Force has a tendency to increase with strain rate, so border line failures may not be identified. 2. The amount of energy that a solder ball can absorb decreases with the presence of voids and the percentage difference in energy between failure modes is considerably more apparent than force
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/high-strain-rate?con=t&page=10
. Force has a tendency to increase with strain rate, so border line failures may not be identified. 2. The amount of energy that a solder ball can absorb decreases with the presence of voids and the percentage difference in energy between failure modes is considerably more apparent than force
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/high-strain-rate?con=t
. Force has a tendency to increase with strain rate, so border line failures may not be identified. 2. The amount of energy that a solder ball can absorb decreases with the presence of voids and the percentage difference in energy between failure modes is considerably more apparent than force
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/high-strain-rate
. Force has a tendency to increase with strain rate, so border line failures may not be identified. 2. The amount of energy that a solder ball can absorb decreases with the presence of voids and the percentage difference in energy between failure modes is considerably more apparent than force
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/high-strain-rate?con=t&page=18
. Force has a tendency to increase with strain rate, so border line failures may not be identified. 2. The amount of energy that a solder ball can absorb decreases with the presence of voids and the percentage difference in energy between failure modes is considerably more apparent than force
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/high-strain-rate?con=t&page=7
. Force has a tendency to increase with strain rate, so border line failures may not be identified. 2. The amount of energy that a solder ball can absorb decreases with the presence of voids and the percentage difference in energy between failure modes is considerably more apparent than force
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/high-strain-rate?con=t&page=16
. Force has a tendency to increase with strain rate, so border line failures may not be identified. 2. The amount of energy that a solder ball can absorb decreases with the presence of voids and the percentage difference in energy between failure modes is considerably more apparent than force
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/high-strain-rate?con=t&page=5
. Force has a tendency to increase with strain rate, so border line failures may not be identified. 2. The amount of energy that a solder ball can absorb decreases with the presence of voids and the percentage difference in energy between failure modes is considerably more apparent than force
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/high-strain-rate?con=t&page=17
. Force has a tendency to increase with strain rate, so border line failures may not be identified. 2. The amount of energy that a solder ball can absorb decreases with the presence of voids and the percentage difference in energy between failure modes is considerably more apparent than force
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/high-strain-rate?con=t&page=14
. Force has a tendency to increase with strain rate, so border line failures may not be identified. 2. The amount of energy that a solder ball can absorb decreases with the presence of voids and the percentage difference in energy between failure modes is considerably more apparent than force
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