| http://etasmt.com:9060/te_news_industry/2021-08-31/23964.chtml
(from room temperature to 150°C) Solder paste collapse -- ramp up too fast The solvent in flux cannot vapour thoroughly, so the viscosity of the solder paste will be decreased and cause the paste collapse Soldering ball -- ramp up
| http://etasmt.com/te_news_industry/2021-08-31/23964.chtml
(from room temperature to 150°C) Solder paste collapse -- ramp up too fast The solvent in flux cannot vapour thoroughly, so the viscosity of the solder paste will be decreased and cause the paste collapse Soldering ball -- ramp up
| http://etasmt.com/cc?ID=te_news_bulletin,9161&url=_print
. Too much pressure on the placement may also result in bridging defects. (4). Preheat. If the preheating of the equipment does not meet the standard, the temperature rise of the reflow soldering equipment is too fast, which causes the solvent in the solder paste to not completely
| http://etasmt.com/cc?ID=te_news_bulletin,18961&url=_print
. If the external temperature of the component rises too fast, it will cause fracture. 2. The flux is active and the chemical cleaning action starts
| http://etasmt.com/cc?ID=te_news_bulletin,19361&url=_print
) to limit boiling and splashing and prevent the formation of small tin particles. In addition, some components affect the internal Stress is more sensitive, if the external temperature of the component rises too fast, it will cause fracture. 2
| http://etasmt.com/cc?ID=te_news_bulletin,14361&url=_print
. Temperature setting in the reflow heating zone: The heating rate should be set at 2 to 4 ° C / sec. The heating rate in the preheating zone is too fast, which easily degrades the solder paste's fluidity and composition, and easily causes popping and soldering
| http://etasmt.com/cc?ID=te_news_bulletin,15361&url=_print
. Temperature setting in the reflow heating zone: The heating rate should be set at 2 to 4 ° C / sec. The heating rate in the preheating zone is too fast, which easily degrades the solder paste's fluidity and composition, and easily causes popping and soldering
| http://etasmt.com/cc?ID=te_news_bulletin,21161&url=_print
. If it is too fast, thermal shock will occur, and both the circuit board and components may be damaged; if it is too slow, the solvent will evaporate
| http://etasmt.com:9060/te_news_bulletin/2020-09-19/19361.chtml
) to limit boiling and splashing and prevent the formation of small tin particles. In addition, some components affect the internal Stress is more sensitive, if the external temperature of the component rises too fast, it will cause fracture. 2
| http://etasmt.com/te_news_bulletin/2019-08-05/9161.chtml
. Too much pressure on the placement may also result in bridging defects. (4). Preheat. If the preheating of the equipment does not meet the standard, the temperature rise of the reflow soldering equipment is too fast, which causes the solvent in the solder paste to not completely
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