Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5218
. Additional QFN components currently are under test and those results will be reported at a future date. Finite element analysis (FEA) has been incorporated into the program to aid in correlating the relationship between the package attributes, PCB properties and thickness, and cycles to failure in each of the test profiles. Key Words
Surface Mount Technology Association (SMTA) | https://www.smta.org/panpac/Pan-Pacific-2020-Program.pdf?v=20060405647
*Osamu Suzuki, Namics Corporation 1:15PM - 1:45PM Lehua/Hau An FEA and DOE Analysis to Predict Deformation and Warpage of Optoelectronics Package Lids Daryl Santos, Ph.D
Surface Mount Technology Association (SMTA) | https://www.smta.org/panpac/Pan-Pacific-2020-Program.pdf?v=20061608649
*Osamu Suzuki, Namics Corporation 1:15PM - 1:45PM Lehua/Hau An FEA and DOE Analysis to Predict Deformation and Warpage of Optoelectronics Package Lids Daryl Santos, Ph.D
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