GPD Global | https://www.gpd-global.com/pcdpumpseries-optimizeddisppath-max2.php
. A desirable end result of an underfill process has a uniform fillet around the component that doesn't wet to other devices or cover large areas around the component
GPD Global | https://www.gpd-global.com/underfill-dispense-path-optimization.php
. A desirable end result of an underfill process has a uniform fillet around the component that doesn't wet to other devices or cover large areas around the component
GPD Global | https://www.gpd-global.com/underfill-dispense-software.php
. A desirable end result of an underfill process has a uniform fillet around the component that doesn't wet to other devices or cover large areas around the component
GPD Global | https://www.gpd-global.com/fluid-dispense-underfill.php
. A desirable end result of an underfill process has a uniform fillet around the component that doesn't wet to other devices or cover large areas around the component
| http://etasmt.com:9060/te_news_industry/2021-08-31/23964.chtml
. Poor solder joint fillet -- ramp up too slow The flux lost its activity once it stayed soaking too long. Reflow zone (above 217°C ~220°C for SAC305 solder paste
| https://www.eptac.com/faqs/ask-helena-leo/ask/post-lead-trimming-reflow-requirements
. Therefore any cut into the solder joint fillet during lead trimming the solder joint must be reflowed. This is also defined in J-STD-001 in paragraph
| https://www.eptac.com/faqs/ask-helena-leo/page/4
. The area for solder touching glass body components is one of them. The IPC mentions this along with the subject of maximum fillet height and the image that sets in some
| http://etasmt.com/te_news_industry/2021-08-31/23964.chtml
. Poor solder joint fillet -- ramp up too slow The flux lost its activity once it stayed soaking too long. Reflow zone (above 217°C ~220°C for SAC305 solder paste
| http://etasmt.com/te_news_industry/2021-09-01/24564.chtml
. The surface finish is not exposed. Dewetting usually refers to alloy solder joints that are not extended to PCB pads, so they do not obtain a good solder joint fillet
