ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-glossary-of-terms
. Disturbed Solder Joint A solder fillet that solidified while the solder joint was moving. The result is a distorted fillet with an irregular surface texture
| https://www.eptac.com/soldertip/accept-or-reject-solder-contacting-component-bodies/
– 8.3.5.5 Flat Gull Wing Leads p Maximum Heel Fillet Height (E). The overall intent is that the solder can climb up the lead but not touch the body
| https://www.eptac.com/faqs/ask-helena-leo/page/9
? Read More Soldering Minimum Space Requirements QUESTION Question: For soldering a wire into a connector fillet, what is the minimum space/area between the wire and the connector walls
| https://www.eptac.com/faqs/soldertips/soldertip/accept-or-reject-solder-contacting-component-bodies
– 8.3.5.5 Flat Gull Wing Leads p Maximum Heel Fillet Height (E). The overall intent is that the solder can climb up the lead but not touch the body
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resources/solder-dictionary-of-terms
. Disturbed Solder Joint A solder fillet that solidified while the solder joint was moving. The result is a distorted fillet with an irregular surface texture
GPD Global | https://www.gpd-global.com/co_website/pcdpumpseries-optimizeddisppath-max.php
. A desirable end result of an underfill process has a uniform fillet around the component that doesn't wet to other devices or cover large areas around the component
GPD Global | https://www.gpd-global.com/co_website/pcdpumpseries-optimizeddisppath-max2.php
. A desirable end result of an underfill process has a uniform fillet around the component that doesn't wet to other devices or cover large areas around the component
GPD Global | https://www.gpd-global.com/co_website/pcdpumpseries-optimizeddisppath.php
. A desirable end result of an underfill process has a uniform fillet around the component that doesn't wet to other devices or cover large areas around the component
GPD Global | https://www.gpd-global.com/pcdpumpseries-optimizeddisppath.php
. A desirable end result of an underfill process has a uniform fillet around the component that doesn't wet to other devices or cover large areas around the component
GPD Global | https://www.gpd-global.com/pcdpumpseries-optimizeddisppath-max.php
. A desirable end result of an underfill process has a uniform fillet around the component that doesn't wet to other devices or cover large areas around the component
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