PCB Libraries, Inc. | https://www.pcblibraries.com/forum/does-capacitor-height-affect-pad-geometry_topic2366_post9714.html
. Minimum Solder Joint Fillet Height = 25% of package Height or 0.50 mm, whichever is less. So the maximum required fillet = 0.50 mm regardless of the package height
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/does-capacitor-height-affect-pad-geometry_topic2366_post10025.html
. Minimum Solder Joint Fillet Height = 25% of package Height or 0.50 mm, whichever is less. So the maximum required fillet = 0.50 mm regardless of the package height
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/does-capacitor-height-affect-pad-geometry_topic2366.html
. Minimum Solder Joint Fillet Height = 25% of package Height or 0.50 mm, whichever is less. So the maximum required fillet = 0.50 mm regardless of the package height
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/does-capacitor-height-affect-pad-geometry_topic2366.html
. Minimum Solder Joint Fillet Height = 25% of package Height or 0.50 mm, whichever is less. So the maximum required fillet = 0.50 mm regardless of the package height
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic2366&OB=ASC.html
. Minimum Solder Joint Fillet Height = 25% of package Height or 0.50 mm, whichever is less. So the maximum required fillet = 0.50 mm regardless of the package height
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_new-2016-solder-joint-goals_topic1921.xml
. Where would I do that globally? For all packages? New 2016 Solder Joint Goals : IPC-J-STD-001 clearly states that... Author: Tom HSubject: 1921Posted: 13 Sep 2019 at 7:53amIPC-J-STD-001 clearly states that the Toe solder joint goal should be a minimum of 25
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic2813&OB=ASC.html
. The IPC-J-STD-001 indicates that the Toe solder joint should be a minimum of 25% of the terminal lead height. I'm reading what appears to be conflicting thoughts on what matters
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/ipcjstd001-chip-component-solder-joints_topic2588_post11181.html
as defined in the IPC-7351 guideline. The Toe solder joint goal is the most important for the Chip Terminal Lead and the J-STD-001 Minimum Fillet Height for a Chip Component for the Toe Goal is
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/ipcjstd001-chip-component-solder-joints_topic2588_post11181.html
as defined in the IPC-7351 guideline. The Toe solder joint goal is the most important for the Chip Terminal Lead and the J-STD-001 Minimum Fillet Height for a Chip Component for the Toe Goal is
