PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/ipcjstd001-chip-component-solder-joints_topic2588_post11181.html
as defined in the IPC-7351 guideline. The Toe solder joint goal is the most important for the Chip Terminal Lead and the J-STD-001 Minimum Fillet Height for a Chip Component for the Toe Goal is
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/ipcjstd001-chip-component-solder-joints_topic2588_post12081.html
as defined in the IPC-7351 guideline. The Toe solder joint goal is the most important for the Chip Terminal Lead and the J-STD-001 Minimum Fillet Height for a Chip Component for the Toe Goal is
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/ipcjstd001-chip-component-solder-joints_topic2588_post12079.html
as defined in the IPC-7351 guideline. The Toe solder joint goal is the most important for the Chip Terminal Lead and the J-STD-001 Minimum Fillet Height for a Chip Component for the Toe Goal is
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/ipcjstd001-chip-component-solder-joints_topic2588_post11251.html
as defined in the IPC-7351 guideline. The Toe solder joint goal is the most important for the Chip Terminal Lead and the J-STD-001 Minimum Fillet Height for a Chip Component for the Toe Goal is
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/ipcjstd001-chip-component-solder-joints_topic2588_post10536.html
as defined in the IPC-7351 guideline. The Toe solder joint goal is the most important for the Chip Terminal Lead and the J-STD-001 Minimum Fillet Height for a Chip Component for the Toe Goal is
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic2588&OB=ASC.html
as defined in the IPC-7351 guideline. The Toe solder joint goal is the most important for the Chip Terminal Lead and the J-STD-001 Minimum Fillet Height for a Chip Component for the Toe Goal is
| https://www.eptac.com/wp-content/uploads/2015/03/ecss_q_st_70_18c-space-product-assurance-rf-coax-cables.pdf
......................................................................................19 4 ECSS‐Q‐ST‐70‐18C 15 November 2008 5.3.3 Cutting cable to initial oversize length ........................................................19 5.3.4 Cable forming and minimum bend radius
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic1921&OB=DESC.html
pad length for a better solder fillet? Is there any rule of thumb in this situations? I was looking at IPC-7351 and couldn't find any info that relates the lead thickness to the pad size. Post Reply Page 1 2
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/new-2016-solder-joint-goals_topic1921&OB=DESC_page1.html
pad length for a better solder fillet? Is there any rule of thumb in this situations? I was looking at IPC-7351 and couldn't find any info that relates the lead thickness to the pad size. Post Reply Page 1 2
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_ipc7351-smd-pth-reference-calculators_topic785.xml
:11pmThe Rectangular End Cap Side Goals need to be addresses in 7351 because Resistors only have metal Terminals on 3 sides and do not (cannot) have a side fillet
