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. Does PCB Pad Finish affect Voiding Levels in Lead-Free Assemblies Nordson DAGE USA - Mid West Region Nordson DAGE Please contact your nearest office for assistance
| https://www.eptac.com/soldertip/soldertips-solderability-issues-with-nickle-plated-surfaces/
. They will re-tin with flux, but reappear following steam-aging. Is this something you have encountered before? Answer: There is a metallurgy issue with soldering to nickel plated surfaces and depending upon the thickness of the final tin/lead coating, the steam aging will penetrate the finish coating and create a
| https://www.eptac.com/faqs/soldertips/soldertip/soldertips-solderability-issues-with-nickle-plated-surfaces
. They will re-tin with flux, but reappear following steam-aging. Is this something you have encountered before? Answer: There is a metallurgy issue with soldering to nickel plated surfaces and depending upon the thickness of the final tin/lead coating, the steam aging will penetrate the finish coating and create a
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5255
. One example of how the interactions between solder and surface finish can affect solder joint integrity is the potential formation of brittle gold/tin intermetallic compounds (IMCs
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