PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/advice-for-solder-mask-paste-mask-layers_topic484.html
. Another example is fine pitch BGA part pads need to be solder mask defined to secure the pad to the board to pass drop tests. It has been proven that during drop tests a BGA solder joint will survive better than the pad ripping off the PCB surface because the pad size is so small
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic484&OB=ASC.html
. These are for example: 1. Solder mask defined pads under fine pitch BGA packages. 2. Multiple separated squares on the paste mask layer to create 50
ASCEN Technology | https://www.ascen.ltd/Products/Solder_paste_printer/394.html
: high printing centering accuracy, good solder paste release effect, and stable printing process, suitable for printing with fine pitch components
1st Place Machinery Inc. | http://www.firstplacemachinery.com/first_place_smt_pcb_aoi_mvp.html
for a variety of component types including: QFP's, SOICs, SOTs, MELFs, Diodes, chips resistors and capacitors, including 10 mil fine pitch and 0402s
| https://www.feedersupplier.com/quality-13118524-samsung-cp45f-smt-pick-and-place-machine
. In addition, it can place any type of components shown in the market, ranging from tiny 0201 to large QFPs; from BGAs to fine pitch CSPs
| http://www.feedersupplier.com/quality-13118524-samsung-cp45f-smt-pick-and-place-machine
. In addition, it can place any type of components shown in the market, ranging from tiny 0201 to large QFPs; from BGAs to fine pitch CSPs
| http://etasmt.com/cc?ID=te_news_industry,4161&url=_print
board pad from oxidizing in the welding, It plays a significant improving effect to improve the weldability of lead-free solder. With the improvement of the packing density and fine pitch (Fine pitch) assembly technologies ,the nitrogen reflow process
1st Place Machinery Inc. | http://www.firstplacemachinery.com/smt_pcb_aoi_cyberopticsse2000.html
Cyberoptics SE 2000 Cyberoptics SE 2000 Paste Inspection Model # Cybersentry 2000 Serial # 350015 Year: May 1997 2D/3D Solder Paste Inspection Includes Accessories Very Good Condition Inspects multiple sites selected by user
| http://etasmt.com/cc?ID=te_news_industry,4361&url=_print
circuit board pad from oxidizing in the welding, It plays a significant improving effect to improve the weldability of lead-free solder. With the improvement of the packing density and fine pitch (Fine pitch) assembly technologies ,the nitrogen reflow
| http://etasmt.com/cc?ID=te_news_industry,24165&url=_print
>> SMT Technical Nitrogen Protection Reflow Oven Lead-free era makes whether need nitrogen in reflow a hot topic . As the lead-free solder flow resistance, wettability is not as good as lead solder, especially when the circuit board pad processed with OSP
