5 fine pitch solder paste bridging root cause results

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The Last Will And Testament of the BGA Void

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/last-will-of-bga-void-1.pdf

. An opposing school of thought was that voids act as crack arrestors, which improve solder joint life. The root cause of voids in BGA solder joints is well understood by the electronics industry with a number of papers published on the topic [1, 2, 3]. R

Heller Industries Inc.

Connection Reception (5:00 PM - 6:00 PM) Hosted By: Michelle Ogihara, Seika Machinery, Inc. & Sherry Stepp, KYZEN Corporation Analysis of the Root Cause for Solder Joint Cracking Chaohui Hu, Weiming Li, P.E., Jianghua Shen, P.E

40731 | https://www.smta.org/smtai/SMTAI-2019-Technical-Program.pdf?v=200609010628

Surface Mount Technology Association (SMTA)

40731

Connection Reception (5:00 PM - 6:00 PM) Hosted By: Michelle Ogihara, Seika Machinery, Inc. & Sherry Stepp, KYZEN Corporation Analysis of the Root Cause for Solder Joint Cracking Chaohui Hu, Weiming Li, P.E., Jianghua Shen, P.E

40731 | https://www.smta.org/smtai/SMTAI-2019-Technical-Program.pdf?v=200622100619

Surface Mount Technology Association (SMTA)

40731

Journal of SMT Articles

Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm

– Low Temperature Co-Fired Ceramic (LTCC) Technology for High Temperature Electronics P. Vianco, J. Rejent, M. Grazier, A. Kilgo, B. McKenzie, A. Allen, E. Guerrero and W. Price Abstract 29-2 Long Term Aging Effects on the Reliability of Lead Free Solder Joints in Ball Grid Array Packages with Various Pitch Sizes and Ball Arrangements Cong Zhao, Chaobo Shen, Zhou Hai

Surface Mount Technology Association (SMTA)