ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/2250-lead-and-paddle-delaminations
. Result Both the die paddle around the die and the inner lead fingers are delaminated (red areas). The pattern of lead finger delamination suggests two possibilities for this condition: 1
1st Place Machinery Inc. | http://www.firstplacemachinery.com/first_place_smt_pcb_wave_solder_ersa1.html
. Fingers are in like new condition and the inside is Super Clean!!! Great opportunity for someone who wants to do a little work. This machine has some dents in the panels, needs front and back covers, and a monitor
1st Place Machinery Inc. | http://www.firstplacemachinery.com/smt_pcb_conveyors_accumulator.html
Accumulator PCB Accumulator Buffer Conveyor Rich Automation Model #AC-IL-50 Serial # 20814 Length of Device: 80" Can take a PCB up to 24" wide Fingers
1st Place Machinery Inc. | http://www.firstplacemachinery.com/first_place_smt_pcb_wave_solder_ersa.html
Width Adjust Computer Controlled Cooling Station after solder unit Finger Conveyor with full set of Titanium Fingers Finger Conveyor has finger cleaner Chip Wave 500 mm (20
1st Place Machinery Inc. | http://www.firstplacemachinery.com/smt_pcb_wave_solder_ersa.html
Width Adjust Computer Controlled Cooling Station after solder unit Finger Conveyor with full set of Titanium Fingers Finger Conveyor has finger cleaner Chip Wave 500 mm (20
Precision PCB Services, Inc | https://precision-pcb-services-inc.com/products/gold-finger-repair
. Home Catalog Blog About us Home › Gold Finger Rework, Gold Finger Repair Gold Finger Rework, Gold Finger Repair $50.00 Default Title - $50.00 USD Quantity Add to Cart We repair, replace and re-plate Gold Fingers, Gold Pads and Gold Contacts
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/1053-pdip-delaminations-on-the-backside
. Result The small red areas are delaminations between the back side of the lead fingers and the molding compound. Delaminations in these areas encourage the collection of moisture and contaminants and the initiation of corrosion
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/1054-lead-delaminations
. Result Red and yellow areas are delaminations of the top side molding compound from the top side both the paddle and lead fingers. Application Note #1053 below shows other aspects of the same PDIP
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/1086-die-and-lead-delaminations
. Result The numerous red and yellow areas are delaminations of the molding compound from both the die face and the lead fingers. Each of these delaminations is a site where contamination and corrosion leading to electrical failure may occur
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/1148-heat-damage
. For lead-free solders the peak temperature could be as high as 260o C. Result Imaging in both instances was performed at 30 MHz. In this component there are no delaminations along the lead fingers
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