Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5218
. Additional QFN components currently are under test and those results will be reported at a future date. Finite element analysis (FEA) has been incorporated into the program to aid in correlating the relationship between the package attributes, PCB properties and thickness, and cycles to failure in each of the test profiles. Key Words
| http://etasmt.com/cc?ID=te_news_industry,3761&url=_print
. This is usually done through finite element analysis. Solder joint modeling must be performed at different levels to take into consideration all aspects of solder joint reliability
| http://etasmt.com:9060/te_news_industry/2013-04-05/3761.chtml
. This is usually done through finite element analysis. Solder joint modeling must be performed at different levels to take into consideration all aspects of solder joint reliability
| http://etasmt.com/te_news_industry/2013-04-05/3761.chtml
. This is usually done through finite element analysis. Solder joint modeling must be performed at different levels to take into consideration all aspects of solder joint reliability
| https://www.eptac.com/faqs/ask-helena-leo/ask/multiple-wash-steps-affecting-resistance-characteristics
. Many reasons could cause this issue, so my suggestion would be to have the component sent to a lab for surface analysis to determine whether or not the problem is contamination or deterioration of the resistive element
Baja Bid | https://bajabid.com/product/ling-dynamics-systems-lds-v730-335t/
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ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/2299-delaminations
- Application Note 2299 Sample & Method A single-sided PC board with a metal heat sink layer bonded to the bottom side. Result Bonding of the heat sink element to the board is incomplete, as seen in the numerous red areas, which are delaminations
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. In general, here are some guidelines for setting heating element temperatures: If there are through hole (TH) components on the board, and you want to reflow them with SMT components together, you may want to consider increasing the bottom
GPD Global | https://www.gpd-global.com/co_website/pdf/pbt/PBFT-VS-SPC-User-Guide-20041102-PBT-002_CD-FORCEWare-v3-3.pdf
. . . . . . . . . . . . . . 33 Save Data Log Files . . . . . . . . . . . . . 35 Print Test Results . . . . . . . . . . . . . . . 37 Change Unit of Force . . . . . . . . . . . . 38 Load Results . . . . . . . . . . . . . . . . . . 39 SPC Analysis
GPD Global | https://www.gpd-global.com/pdf/pbt/PBFT-VS-SPC-User-Guide-20041102-PBT-002_CD-FORCEWare-v3-3.pdf
. . . . . . . . . . . . . . 33 Save Data Log Files . . . . . . . . . . . . . 35 Print Test Results . . . . . . . . . . . . . . . 37 Change Unit of Force . . . . . . . . . . . . 38 Load Results . . . . . . . . . . . . . . . . . . 39 SPC Analysis
