GPD Global | https://www.gpd-global.com/co_website/fluiddispense-appsol-flipchipassembly.php
. Forced air allows any substrate to be heated no matter the geometry or size, but time to heat is longer vs contact heating. The pre-heat area has an optional sensor to monitor product temperature
GPD Global | https://www.gpd-global.com/fluiddispense-appsol-flipchipassembly.php
. Forced air allows any substrate to be heated no matter the geometry or size, but time to heat is longer vs contact heating. The pre-heat area has an optional sensor to monitor product temperature
GPD Global | https://www.gpd-global.com/capillary-underfill-dispensing.php
. Forced air allows any substrate to be heated no matter the geometry or size, but time to heat is longer vs contact heating. The pre-heat area has an optional sensor to monitor product temperature
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Optimizing-Reflowed-Solder-TIM-sTIMs-Processes-for-Emerging-Heterogeneous.pdf
solder ball attach for BGA) on TIMs voiding. Fig. 8 below shows an x-ray result after sTIM reflow, then after subsequent SAC reflow (details later). Fig. 8: Reflow#1 vs. Reflow#2 – same part In the case of Heller Industries, the task was to establish the
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