| https://www.eptac.com/ask/gold-wire-bond-failing-pull-test/
? Does it have a Nickel underplate? How thick is the gold plating? I’ve checked Mil-Std-883F method 2011.7 Bond Strength (Destructive Bond Pull Test
| https://www.eptac.com/faqs/ask-helena-leo/ask/j-std-001f-4-5-1-gold-removal-class-2-requirement-changed
)? Connectors and surface mount oscillators are only available in Gold over Nickel... Question: Why did the IPC make the gold removal requirement for Class 2 products a requirement (D2D3
| https://www.eptac.com/blog/j-std-001-revision-changes-regarding-the-requirements-for-gold-plating-removal
. Because of this, the gold has to be completely removed so that the solder makes the electromechanical and/or metallurgical bond to the subsurface beneath the gold, which in most cases is Nickel
| https://www.eptac.com/ask/j-std-001f-4-5-1-gold-removal-class-2-requirement-changed/
)? Connectors and surface mount oscillators are only available in Gold over Nickel terminations and are difficult to tin and re-package. Answer: The reasoning for the change was due to the failures happening in the field with these types of components
| https://www.eptac.com/j-std-001-revision-changes-regarding-the-requirements-for-gold-plating-removal/
. Because of this, the gold has to be completely removed so that the solder makes the electromechanical and/or metallurgical bond to the subsurface beneath the gold, which in most cases is Nickel
| https://www.eptac.com/faqs/soldertips/soldertip/soldertips-solderability-issues-with-nickle-plated-surfaces
: Solderability Issues with Nickle Plated Surfaces Question: We are working with components with leads of tin/lead over nickel. After the manufacturing processes, some of the pins are exhibiting what appears to be flaking plating, leaving behind unsolderable surfaces
| https://www.eptac.com/soldertips/soldertips-solderability-issues-with-nickle-plated-surfaces/
: Solderability Issues with Nickle Plated Surfaces Question: We are working with components with leads of tin/lead over nickel. After the manufacturing processes, some of the pins are exhibiting what appears to be flaking plating, leaving behind unsolderable surfaces
| https://www.eptac.com/webinars/tempered-leads-class-3-rework-toe-fillets-and-more/
. Definition of Class III Rework. Dissecting Toe Fillets on Gull Wing components. Understanding Gold Plating vs. Gold Flash. Have a question about training or IPC certification
| https://www.eptac.com/webinars/tempered-leads-class-3-rework-toe-fillets-and-more
. Definition of Class III Rework. Dissecting Toe Fillets on Gull Wing components. Understanding Gold Plating vs. Gold Flash. More Webinars Flux Classification – Part 1
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