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Materials - Composite Materials - Counterfeit Detection Microelectronics - Bonded Wafer FLAT WAFERS AND WARPED WAFERS IMAGED ACOUSTICALLY As published in Silicon Semiconductor, July 2018 IMAGING AND ANALYSIS USING MATCHED ACOUSTIC TOOLS
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. (Average of AC V/mil (kV/mm), (118) (118) (236) (197) (177) (118) ten specimens.) Flat sheets in min. air placed between 1⁄4″ (6 mm) diameter brass electrodes with 1⁄32″ (0.8 mm
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. Yi Abstract 2016 29-3 Thermal Mechanical Fatigue of a 56 I/O Plastic Quad-Flat Nolead (PQFN) Package M. Neilsen and P. Vianco Abstract 29-3 Validated Solder Coverage for Tin Whisker Mitigation of 0402 Ceramic Capacitors
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