PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/topic1687&OB=ASC.html
: PTH holes should now be translating properly Fixed a problem with 180 degree arcs in pads getting flattened by CR-5000. They were converted into two 90 degree arcs, which should achieve the desired result
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic1687&OB=DESC.html
: PTH holes should now be translating properly Fixed a problem with 180 degree arcs in pads getting flattened by CR-5000. They were converted into two 90 degree arcs, which should achieve the desired result
| https://www.eptac.com/ask/inspection-criteria-for-unique-lead-geometry/
. The section to use is 8.3.6, Round or Flattened (coined) Gull Wing Leads, and the dimension you are looking for is Dimension Q, Minimum Side Joint Height
| https://www.eptac.com/ask/gullwing-lead-deformation/
% of the diameter, width, or thickness of the lead except as allow for flattened leads. Exposed basis metal is acceptable is deformation does not exceed 10
| https://www.eptac.com/faqs/ask-helena-leo/ask/gullwing-lead-deformation
“…parts or components shall not [D1, D2, D3] be mounted if the part or component lead has nicks or deformation exceeding 10% of the diameter, width, or thickness of the lead except as allow for flattened leads
| https://www.eptac.com/wp-content/uploads/2021/11/webinar_eptac_05_19_10.pdf
This is a stack up of BGA types of packages New Section 8.3.15 Flattened Post Connections, Round Solder Land Criteria for Class 3 has not been established for this device, so only requirements are for Class 1 and 2 17 Highlights of 001 Changes
Imagineering, Inc. | https://www.pcbnet.com/blog/causes-of-pcb-warping-how-to-prevent-it/
– once a PCB has been completed, the warpage is permanent. While methods for flattening boards are used by some manufacturers, the effect is often not great, and it can rebound after it has been flattened
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/publications
FLATTENED ACOUSTICALLY As published in Chip Scale Review, Jan/Feb 2016 AUTOMATING C-SAM PROCESS CONTROL FROM LAB TO FAB TO BACKEND As Presented at SMTA China 2014
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