ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/industries/medical-life-science-and-pharmaceutical?con=t&page=2
BOND DEFECTS Nordson SONOSCAN Flip Chip Underfill Void and Solder Bump Defects - Application Note 1016 HEAD SINK AND ADHESIVE Nordson SONOSCAN Flip Chip Heat Sink Attach - Application Note 355 First
| https://www.smtfactory.com/SMT-PCBA-ic265772.html
Robot Dispensing Robot Routing Robot SMT Peripheral Equipments Consumables Solder Bar Solutions LED Industry LED Flip Chip LED Industry 02 SMT PCBA Consumer Electronics Special Soldering and Curing
| https://www.smtfactory.com/Special-Soldering-and-Curing-ic245772.html
Robot Dispensing Robot Routing Robot SMT Peripheral Equipments Consumables Solder Bar Solutions LED Industry LED Flip Chip LED Industry 02 SMT PCBA Consumer Electronics Special Soldering and Curing
| https://www.smtfactory.com/Testing-and-Validation-ic235772.html
Robot Dispensing Robot Routing Robot SMT Peripheral Equipments Consumables Solder Bar Solutions LED Industry LED Flip Chip LED Industry 02 SMT PCBA Consumer Electronics Special Soldering and Curing
1st Place Machinery Inc. | http://www.firstplacemachinery.com/firstplace_cr_technology_crx2000_xray.html
CR Technology CRX 2000 CR Technology CRX2000 Xray Equipment Description CR Technology Model Number: CRX2000 Serial Number: 1S1878.0100 Year 2000-2001 Hamamatsu Tube Type -130kV X-Y-Z indexing table with joystick control 18" x 24" X-Y travel Full 360 degrees rotation and tilt up to 90 degrees BGA / Flip Chip Solder joint quality
1st Place Machinery Inc. | http://www.firstplacemachinery.com/firstplace_asymtek_1010_dispenser.html
4.7.1 Left to Right Flow Pass Thru Conveyor System Weight Scale Computer Controlled CE Marked 208-220 Volt - 50/60 HZ Recommended Applications from the manufactures website Underfill for flip chip and chip scale packaging Chip Encapsulation Dam and Fill Solder Paste Thermal Compounds
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/industries/automotive-and-transportation?con=t&page=2
. Sonoscan's Acoustic Micro Imaging (AMI) techniques detect these… LEAD AND PADDLE DELAMINATIONS Nordson SONOSCAN SOJ Lead and Paddle Delaminations - Application Note 2250 VOIDS AND BOND DEFECTS Nordson SONOSCAN Flip Chip Underfill Void and Solder Bump Defects
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/fluid-types/underfill?con=t&page=2
: Underfill Flux Nordson ASYMTEK Efficient application of flux in precise, thin patterns maximizes throughput and quality for flip chip and CSP production Underfilling Flip Chip Die Using Continuous
1st Place Machinery Inc. | http://www.firstplacemachinery.com/firstplace_yestech_ytx3000_xray.html
) Variable zoom magnification to 120x Full 360 degrees of rotation *BGA / Flip Chip * Solder joint quality * Voids * Bond wires * Electronic and Sealed Assemblies
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/your-process/fluid-types/underfill
. Underfill is applied at the following stages of the manufacturing process to improve reliability. Wafer and Panel-Level Underfill Underfill is applied within flip-chip, 2D
