1st Place Machinery Inc. | http://www.firstplacemachinery.com/firstplace_smt_pcb_semiconductor_rework_conceptronics.html
0.001 inches Handles both grid array and leaded type components. (BGA, CGA, QFP, LCC, TSOP, FLIP-Chip and many others.....) Able to repair board with up to a
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/products/jets?con=t&page=8
ASYMTEK’s jet dispensing Jet - DispenseJet DJ-2200 Spray Valve Nordson ASYMTEK Nordson ASYMTEK's DispenseJet® DJ-2200 spray valve delivers uniform, thin-layer dispensing of materials and superior edge definition for coating applications in flip chip and other semiconductor
1st Place Machinery Inc. | http://www.firstplacemachinery.com/firstplace_asymtek1020.html
pumps Supports a full range of applications, including flip chip and CSP underfill, dam and fill, die attach, and thermal compounds Unique CAN bus architecture for efficient operations now, and
1st Place Machinery Inc. | http://www.firstplacemachinery.com/first_place_smt_pcb_dispensers_asymtek1020a.html
pumps Supports a full range of applications, including flip chip and CSP underfill, dam and fill, die attach, and thermal compounds Unique CAN bus architecture for efficient operations now, and
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/about-us/events/imaps-nordic-conference-2015
& Advanced packaging Monday, June 8, 2015 1:30 p.m. - 3:10 p.m. (13:30 - 15:10) Abstract : Flip chip technology got into full swing in the 1990s, mainly for PC’s MPU packaging
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/sonoscan-applications/microelectronics
–Method 2030 Chip Scale Package (CSPs) Flip Chips Stacked Dies Ball Grid Arrays (BGAs, CBGAs) Tape Automated Bond (TAB) Mil-STD-883–Method 2035 Hybrids, MCMs, SIPs Flex Circuits Printed Circuit Boards (PCB
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/applications/dispensing-fluids-general?con=t&page=5
#1F61 Nordson ASYMTEK Throughput increased 60-85% for electronics packaging applications like flip-chip underfill, chip encapsulation, and thermal compounds Nordson ASYMTEK’s Tilt
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/products/fluid-dispensing-systems?nor_division_facet_b=f65ab511444f4ce087bae3fb19491a82&con=t&page=36
#1F61 Nordson ASYMTEK Throughput increased 60-85% for electronics packaging applications like flip-chip underfill, chip encapsulation, and thermal compounds SEMICON China 2016 - Hall N4, Booth 4571 Nordson ASYMTEK Check out Nordson ASYMTEK, DAGE
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/products/fluid-dispensing-systems?con=t&page=36
#1F61 Nordson ASYMTEK Throughput increased 60-85% for electronics packaging applications like flip-chip underfill, chip encapsulation, and thermal compounds SEMICON China 2016 - Hall N4, Booth 4571 Nordson ASYMTEK Check out Nordson ASYMTEK, DAGE
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/products/fluid-dispensing-systems?nor_division_facet_b=f3e634b8e6264bd6b177140b0231e749&con=t&page=37
% for electronics packaging applications like flip-chip underfill, chip encapsulation, and thermal compounds Selectivity in Conformal Coating ASYMTEK Products Utilize selectivity and start coloring
