Partner Websites: flux activity vs. reactivity (Page 1 of 1)

Solder Paste Shelf Life and Testing - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/soldertip/solder-paste-shelf-life-and-testing/

. Since the flux is in constant contact with the solder powder, it is continually acting on the oxides on the surfaces of the solder powder or spheres, and this action reduces the activity levels of the fluxes

Solder Selection Guide

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-selection-guide

. FLUX COMPARISON Low Activity Medium Activity High Activity Flux Comparison chart shows relative activity ranges of each flux category

ASYMTEK Products | Nordson Electronics Solutions

Solder Selection Guide | Nordson EFD

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resources/solder-selection-guide

.   FLUX COMPARISON Low Activity Medium Activity High Activity Flux Comparison chart shows relative activity ranges of each flux category

ASYMTEK Products | Nordson Electronics Solutions

What’s with the expiration dates on solder paste or wire? - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/soldertip/whats-with-the-expiration-dates-on-solder-paste-or-wire/

don’t want to be liable for failures in the field due to old material. As for the cored wire solder, similar storage issues apply, but more to the point, the real concern is the changing activity of the flux in the core due to its corrosive or acidity properties working

00600-248

Heller 公司 | http://hellerindustries.com.cn/00600-248.pdf

. Applications for which the (a) profile are appropriate include pastes that require a dwell time at 150° to 160°C to allow for flux activation, and for IR-based ovens that create large temperature differentials (∆T

Heller 公司

How Challenging Conventional Wisdom Can Optimize Solder Reflow

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/00600-248.pdf

. Applications for which the (a) profile are appropriate include pastes that require a dwell time at 150° to 160°C to allow for flux activation, and for IR-based ovens that create large temperature differentials (∆T

Heller Industries Inc.

How Challenging Conventional Wisdom Can Optimize Solder Reflow

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/00600-248-1.pdf

. Applications for which the (a) profile are appropriate include pastes that require a dwell time at 150° to 160°C to allow for flux activation, and for IR-based ovens that create large temperature differentials (∆T

Heller Industries Inc.

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