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: B Date: 19-Apr-2000 exit tunnels, and customer’s desired product temperature profile. Obtaining the minimum total flux vapor flow out of the oven results in maximum residence time within the cooling module which in turn maximizes condensation efficiencies of the system
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Solder Paste and Flux Frequently Asked Questions | Nordson EFD Search Arrow Black Arrow Right Arrow Youtube Twitter Facebook Paper Plane LinkedIn Zoom In Grid Envelope Earth Download File - Document 9 Boxes Browser Calendar Chart Click Icon Close
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won’t hurt or degrade the product if left on the boards after soldering. Fully active fluxes, if left behind, are susceptible to the absorption of moisture which is a problem when the product is in the field as the flux residues are still active and when moisture is
| https://www.eptac.com/soldertips/soldertip-44-ipc-guidelines-for-flux-selection-and-use/
. Things to consider on your product are entrapment areas where the flux may travel to and you cannot clean it off. This can be a major problem with surface mount components, especially those mounted very close to the surface of the board, such as micro BGAs, chip caps and resistors. So where are we
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. A panel heater is mounted on the top of the entrance tunnel. This heater keeps the sheet metal above flux condensation temperature to prevent flux accumulation and dripping
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), decreasing cooling and condensation efficiencies. The time period for this may vary depending on the type of solder paste flux used, the weekly consumption rate of paste, and oven temperature profiles
| http://etasmt.com:9060/te_news_bulletin/2021-08-31/23761.chtml
. A panel heater is mounted on the top of the entrance tunnel. This heater keeps the sheet metal above flux condensation temperature to prevent flux accumulation and dripping
| http://etasmt.com/te_news_bulletin/2021-08-31/23761.chtml
. A panel heater is mounted on the top of the entrance tunnel. This heater keeps the sheet metal above flux condensation temperature to prevent flux accumulation and dripping
| http://etasmt.com/te_news_bulletin/2021-09-02/24761.chtml
), decreasing cooling and condensation efficiencies. The time period for this may vary depending on the type of solder paste flux used, the weekly consumption rate of paste, and oven temperature profiles