| https://www.eptac.com/ask/soldering-stranded-wire/
3.3 Flux, stating within the paragraph that “… Type H or M fluxes shall not [D1, D2, D3] be used for tinning of stranded wires.” Once the wires are tinned and assembled to their respective terminations, be it either a terminal, or a printed circuit board, other approved fluxes can be used to make those connections
| http://etasmt.com/te_news_bulletin/2021-08-31/23573.chtml
. Process and design-related causes: • Solder paste flux not aggressive enough for level of oxidation present on part or PCB • PCB pad contaminated
| https://www.eptac.com/faqs/soldertips/soldertip/soldertip-46-open-connections-found-on-bga-components
. We have experimented with many minor adjustments, yet this occasional problem continues. Do you have any suggestions? Answer: Based upon the warp and twist characteristics of the printed board laminate materials and the BGA, this could be a […] Question
| https://www.eptac.com/soldertips/soldertip-46-open-connections-found-on-bga-components/
. We have experimented with many minor adjustments, yet this occasional problem continues. Do you have any suggestions? Answer : Based upon the warp and twist characteristics of the printed board laminate materials and the BGA, this could be a major starting point for investigating this condition
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/select/technologies-or-options/drop-jet-fluxing
: The Nordson SELECT FluxJet Precision Drop-Jet Flux Dispenser is recommended for no-clean processing when printed circuit boards will not be cleaned after selective soldering
| https://pcbasupplies.com/desoldering-braid-one-step-0-075-x-5-antistatic-25-pack/
: EasyBraid Description Additional information Description DESOLDERING BRAID, ONE STEP, 0.075″ X 5′, ANTISTATIC, 25/PACK Used in the rework and repair of printed circuit boards, computers, cell phones, or other electronics Easily removes solder from components or pads on a circuit board
| http://etasmt.com:9060/te_news_bulletin/2020-11-13/20561.chtml
-distributed on the printed board pads. weld. Reflow soldering is to solder components to the PCB board, and reflow soldering is to mount components on the surface
| https://www.eptac.com/soldertips/soldertips-issues-with-incomplete-solder-reflow-in-production-2/
: I’m not exactly sure of what you mean by flux exhaustion, however; my interpretation is, there wasn’t enough flux in the solder paste to prepare the pad/land area and have the molten solder flow over the complete pad or land area itself
Imagineering, Inc. | https://www.pcbnet.com/blog/considerations-for-pcb-board-design-layout/
– Layer assignment is critical for designing a printed circuit board that will function. Pads for SMD components must appear on the surface layer, though-hole components must have defined layer spans for holes, and silkscreen and mechanical outlines need to be defined in their own layers
| https://www.eptac.com/solder-tips/
: I have always had in the back of my head that burnt flux is a defect for all class 3 assemblies. Upon further review I have not been able to identify the specific section of the IPC-A-610F standard which identifies burnt flux as an acceptable or defect condition
