19 foreign object size criteria results

? •  This document is a derivative document. – To meet the IPC requirements, the following issues need to be addressed. •  Design Criteria, based upon the 2200 series documents

| https://www.eptac.com/wp-content/uploads/2015/02/eptac_03_18_15-1.pdf

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The Last Will And Testament of the BGA Void

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf

correlation between solder joint void size/location and solder joint thermal cycle integrity existed for the thermal cycle range of -55°C to +125°C; (2) derive a BGA/CSP solder joint void criteria for submission to the IPC-JSTD- 001 committee. PROCEDURES Test

Heller Industries Inc.

The Last Will And Testament of the BGA Void

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/last-will-of-bga-void-1.pdf

correlation between solder joint void size/location and solder joint thermal cycle integrity existed for the thermal cycle range of -55°C to +125°C; (2) derive a BGA/CSP solder joint void criteria for submission to the IPC-JSTD- 001 committee. PROCEDURES Test

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•  Intermetallic Compounds and Growth rates. •  Strain Rates •  Impact of thermal cycling on grain size growth rates 22 Section 9 Soldering 23 Section 9 Soldering Lead-free soldering process Considerations

| https://www.eptac.com/wp-content/uploads/2013/09/eptac_09_18_13.pdf