ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/applications/test-and-inspection?page=1
. Detect a wide range of manufacturing defects including BGA, QFN and IGBT attachment, PTH filling, interfacial voiding, component cracking
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/first-bond-ball-pull-stud-bump-pull?con=t&page=7
recording failure mode images upon completion. Paragon Bondtesting Software Technical Informer Nordson DAGE Micro Fracture of Glass Composites using Hot Probe Attach Application Note Nordson DAGE Correlating the Presence of Popcorned BGA Devices
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm
Anderson, Ph.D. Abstract 27-2 Reliability Degradation of SAC105 and SAC305 BGA Packages Under Long-Term, High Temperature Aging Zhou Hai, Jiawei Zhang, Chaobo Shen, E. K. Snipes, J. C. Suhling, M. J. Bozack and J. L. Evans Abstract 27-2 3-D Fracture Analysis
COT specializes in high quality SMT nozzles and consumables for pick and place machines. We provide special engineering design service of custom nozzles for those unique and odd components.
2481 Hilton Drive
Gainesville, GA USA
Phone: (770) 538-0411
.png)
