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. Why Use A Vacuum In Reflow Soldering? There are five ways to eliminate voids that will improve product performance. 1. Improve heat dissipation of components or solder joint structures (i.e
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package size became progressively smaller. For this reason it is necessary to take a different and more robust approach. The traditional method addressed the normalized load on the component during placement, but it cannot effectively account for the initial impact spike
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: AA8MG00 Size: 5.0G Brand: FUJI Get Best Price 509# SMT Nozzle 40025165 For JUKI KE750 / 760 / 2010 / 2020 / 2050 / 2060 Brand: JUKI Country: Japan Condition: Original New Model: 509 Get Best Price FUJI CP643 AWPH9702
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