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. Solder preforms can be coated, flux laminated between layers of different alloy or simply compressed cored solder wire. In the distant past some assembly operations have simply employed cored wire wrapped around a screwdriver or knitting needle and cut to form rings
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Zhang Abstract 28-1 PoP Rework - A Case Study Robert Wettermann Abstract 2014 27-4 The Effects of Reflow Profile Parameters on Sn-Ag-Cu Solder Bumps and Cu Substrate Using Full Factorial Design Gabriel Takyi, Ph.D. and Peter K. Bernasko, Ph.D. Abstract 27
