ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/2535-substrate-delaminations
Delaminations - Application Note 2535 Sample & Method A plastic BGA. Planar C-SAM image gated within the substrate. Result The two bright circular regions at left are extensive delaminations, where layers in the substrate have separated
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/2581-multiple-voids
- Application Note 2581 Sample & Method Two silicon wafers, bonded together. Echoes were gated at the depth of the bond between the two wafers
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/2518-lead-delaminations
- Application Note 2518 Sample & Method Five Quad Flat No-Lead devices (QFNs). The return echoes were gated at the depth of the die, lead frame and paddle to molding compound interfaces
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/2596-delaminations-in-substrate
BGA - MC to Substrate Delamination - Application Note 2596 Sample & Method In the image the echoes from the ultrasonic C-SAM transducer were gated on the interface between the molding compound and the substrate
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/0900-delaminations-and-cracks
Delaminations and Cracks - Application Note 900 Sample & Method In the image the echoes from the ultrasonic transducer were gated on the interface between the silicon stack and the silicone adhesive layer on a large solar panel
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/0902-delaminations
Defects - Application Note 902 Sample & Method In the image the echoes from the ultrasonic transducer were gated on the interface between the silicon stack and the connector box on a large solar panel
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/0903-delaminations
Bar Delaminations - Application Note 903 Sample & Method In the image the echoes from the ultrasonic transducer were gated on the interface between the silicon stack and the patterned metallic buss bar on a large solar panel
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/2575-contamination-causing-delaminations
. Echoes were gated at the depth of the bond between the two wafers. Result There are two types of defects at this depth. First, the large white area at center is a large delamination
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/0904-delaminations
Delaminations - Application Note 904 Sample & Method In the image the echoes from the ultrasonic transducer were gated on the interface between the solar cell die attach and the substrate
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/2083-voids-and-delaminations
, ½” focal length transducer. The echoes were gated to include the bulk, active area of the capacitor between the top and back surfaces
