Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm
, Ph.D, Sitaram Arkalgud, Ph.D, and Eric Tosaya Abstract 29-1 Effect of Gold and Copper on AuSn4 Deposition and Isothermal Durability of SAC305 Solder Joints Subhasis Mukherjee, Carlos Morillo, Lay-Ling Ong, Julie Silk, and
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
] Figure 2 illustrates Weibull plots that show that BGAs with voids (i.e. Mod Profile) and BGAs without voids (i.e. Standard Profile) did not have distinguishable solder joint failure populations. Banks
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/last-will-of-bga-void-1.pdf
] Figure 2 illustrates Weibull plots that show that BGAs with voids (i.e. Mod Profile) and BGAs without voids (i.e. Standard Profile) did not have distinguishable solder joint failure populations. Banks
Surface Mount Technology Association (SMTA) | https://www.smta.org/education/presentations/presentations.cfm
(SAC105, SAC305, matched solder sphere - paste) with Bi-based solder pastes on the component reliability in accelerated thermal cycling is studied
Surface Mount Technology Association (SMTA) | https://www.smta.org/webinars/
(SAC105, SAC305, matched solder sphere - paste) with Bi-based solder pastes on the component reliability in accelerated thermal cycling is studied
