Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/last-will-of-bga-void-1.pdf
] Figure 2 illustrates Weibull plots that show that BGAs with voids (i.e. Mod Profile) and BGAs without voids (i.e. Standard Profile) did not have distinguishable solder joint failure populations. Banks
Surface Mount Technology Association (SMTA) | https://www.smta.org/education/presentations/presentations.cfm
(SAC105, SAC305, matched solder sphere - paste) with Bi-based solder pastes on the component reliability in accelerated thermal cycling is studied
Surface Mount Technology Association (SMTA) | https://www.smta.org/webinars/
(SAC105, SAC305, matched solder sphere - paste) with Bi-based solder pastes on the component reliability in accelerated thermal cycling is studied
