ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/products/acoustic-inspection-systems/aw-series
. The system is designed to handle wafer level products (BSI sensors, SOI, MEMS, LEDs, Chip-on-Wafer and Unpolished Wafers) manufactured by virtually any method, including bonding processes using direct fusion, anodic, glass frit and epoxy bonding
| https://www.eptac.com/faqs/ask-helena-leo/ask/multiple-wash-steps-affecting-resistance-characteristics
. The other issue may be the glass frit on the resistive element, it may be missing, which would, or could, impact the functionality of the resistive element against the solvent to which it will be exposed
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