| https://www.eptac.com/soldertips/soldertips-solderability-issues-with-nickle-plated-surfaces/
. Recent Posts Solder Pot Maintenance and Dross Removal What’s with the expiration dates on solder paste or wire? Accept or Reject: Solder Contacting Component Bodies Issues of Burnt Flux on Class 3 PCB Assemblies Gold Removal Issues with Hollow Cup Connectors Acceptability of Conformal Coating Bubbles Search Looking for Training Products? SolderTraining.com can help
? Read Answer Failing to Remove Gold Plating in Final Assembly Question: If the gold plating on the surface of via holes is not removed from the printed circuit boards, does this constitute a defect or failure of the
Imagineering, Inc. | https://www.pcbnet.com/quote/board-quote-china/?cpn=1
China Fab Quote – Imagineering Back to Imagineering New Quote login Login Create Account Discount PCB Fabrication China Input your PCB fabrication specifications below and
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5255
) when the solder gold content exceeds 5% by weight. Controlling the component gold plating thickness as well as the soldering process temperature and time can prevent gold embrittlement
| https://www.eptac.com/webinars/page/2
: When Gold Removal is a Must Length: 31 Minutes We hear/are asked this question all the time. When do I need to remove gold plating and why do I have too
| https://www.eptac.com/soldertips/defining-shear-forces-for-surface-mounted-components/
. Solder joint strength is based upon many things, such as size of pad/land, amount of solder, excursion through the thermal zone, plating integrity of the component and the board, etc
Imagineering, Inc. | https://www.pcbnet.com/quote/board-quote/?cpn=0
* Materials FR4(130Tg) FR4(170Tg) Copper Weight 1 oz 2 oz 3 oz 4 oz Finish Plating HASL (Leaded) LF HASL Immersion Gold Immersion Silver White Tin OSP Minimum Trace/Space 0.005" 0.006" 0.007
| https://www.eptac.com/faqs/soldertips?hsLang=en
: Gold Removal and Wave Soldering vs Hand Soldering General Tip Question: Regarding gold removal requirement under Section 4.5.1 of J-STD-001, it allows
| https://www.eptac.com/faqs/soldertips
: Gold Removal and Wave Soldering vs Hand Soldering General Tip Question: Regarding gold removal requirement under Section 4.5.1 of J-STD-001, it allows
Qinyi Electronics Co.,Ltd | https://www.qy-smt.com/shop/page/128
0.0 CNY CM 3 head Special Nozzle 6000 ¥ 0.00 0.0 CNY BM 88MM Pneumatic Feeder ¥ 0.00 0.0 CNY Finger metal brush (20*70mm) ¥ 0.00 0.0 CNY Finger nylon brush