| https://www.eptac.com/faqs/soldertips/soldertip/gold-removal-issues-with-hollow-cup-connectors
: We are having a hard time with the removal of gold from hollow cup connectors. Using lead free solder, we are wicking the solder out with braid, but what is happening is that the pins are getting overheated and coming loose from the connector
| https://www.eptac.com/soldertip/gold-removal-issues-with-hollow-cup-connectors/
: We are having a hard time with the removal of gold from hollow cup connectors. Using lead free solder, we are wicking the solder out with braid, but what is happening is that the pins are getting overheated and coming loose from the connector
PCB Libraries, Inc. | https://www.pcblibraries.com/POD/Default.asp?M=AMPHENOL&PN=132134
! customer login required - 2 credits Status: Active Updated: 4/24/2018 Mounting Type: Through-hole Logical Description: Connector, Co-Axial, Vertical, Plug, Gold Physical Description
PCB Libraries, Inc. | https://www.pcblibraries.com/POD/Default.asp?M=AMPHENOLCA&PN=MRJ-5380-01
, 2.54 mm Pitch, RJ45, Right Angle, Dual Row, Gold Physical Description: Connector, RJ45 Right Angle; 10 pin, 30.30 mm L X 26.95 mm W X 18.25 mm H body Commonly Visited: Discussion Forum Software User Guide Free Downloads Contact us Websites Contact Sales, Training, Support
PCB Libraries, Inc. | https://www.pcblibraries.com/POD/Default.asp?M=AMPHENOL&PN=12401832E402A
, 0.50 mm Pitch, HDMI, Receptacle, Right Angle, Dual Row, Gold Physical Description: Connector, HDMI Right Angle; 28 pin, 9.20 mm L X 10.50 mm W X 3.38 mm H body Commonly Visited: Discussion Forum Software User Guide Free Downloads Contact us Websites Contact Sales, Training, Support
| https://www.eptac.com/faqs/ask-helena-leo/ask/what-is-the-correct-way-to-fill-solder-cups
. According to J-STD-001, 4.5.1 Gold Removal From at least 96& of the surfaces to be soldered of the through hole component leads with 2.54 um [100uin.} or more of gold thickness
| https://www.eptac.com/ask/what-is-the-correct-way-to-fill-solder-cups/
. According to J-STD-001, 4.5.1 Gold Removal From at least 96& of the surfaces to be soldered of the through hole component leads with 2.54 um [100uin.} or more of gold thickness