12 gold embrittlement joint microsectio results

J-STD-001 Revision Changes Regarding The Requirements for Gold Plating Removal

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entire solder joint.   The emphasize of these changes are due to problems in the field with gold embrittlement, simply stating that all plated through hole components that are to be hand soldered must be tinned regardless

J-STD-001 Revision Changes Regarding The Requirements for Gold Plating Removal - EPTAC - Train. Work

| https://www.eptac.com/j-std-001-revision-changes-regarding-the-requirements-for-gold-plating-removal/

entire solder joint.   The emphasize of these changes are due to problems in the field with gold embrittlement, simply stating that all plated through hole components that are to be hand soldered must be tinned regardless

. Gold embrittlement is not a visually inspectable anomaly. In cases where analysis has determined there is a gold embrittlement condition, the gold embrittlement shall [N1D2D3

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•  Gold: –  Porous –  Can be too thick –  Dissolves in Eutectic Tin/Lead –  Creates embrittlement of solder joints 7 What is the Problem

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Dissolution Rate of Specific Elements in SAC305 Solder

Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5255

. One example of how the interactions between solder and surface finish can affect solder joint integrity is the potential formation of brittle gold/tin intermetallic compounds (IMCs

Surface Mount Technology Association (SMTA)

. Original circuits were HASL, new products have ENIG Question: •  Will this create any gold embrittlement with the use of ENIG? 2 Question #1 •  From IPC 6012 Table 3-2 Final Finish and Coating Requirements, the parameters for ENIG coating is as shown

| https://www.eptac.com/wp-content/uploads/2016/08/eptac_08_17_16.pdf

. Original circuits were HASL, new products have ENIG Question: •  Will this create any gold embrittlement with the use of ENIG? 2 Question #1 •  From IPC 6012 Table 3-2 Final Finish and Coating Requirements, the parameters for ENIG coating is as shown

| https://www.eptac.com/wp-content/uploads/2021/11/eptac_08_17_16.pdf

Webinars - EPTAC - Train. Work Smarter. Succeed (2)

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& Leo Soldertips Why Get IPC Certified Blog Webinars FAQ’s About Us Instructors Consulting Services Customized Training Press Releases Careers Corporate Video Contact Webinars Previous Webinars Gold Embrittlement

, Karl Loh, Zymet Day 3 Concludes An Investigation on the Influence of Copper and Nickel Solderable Surfaces on Solder Joint Degradation due to Gold Embrittlement Daphne Gates, Collins Aerospace Aerosol Jet Direct Writing Polymer-Thick-Film Resistors for

40731 | https://www.smta.org/smtai/SMTAI-2019-Technical-Program.pdf?v=200609010628

Surface Mount Technology Association (SMTA)

40731

, Karl Loh, Zymet Day 3 Concludes An Investigation on the Influence of Copper and Nickel Solderable Surfaces on Solder Joint Degradation due to Gold Embrittlement Daphne Gates, Collins Aerospace Aerosol Jet Direct Writing Polymer-Thick-Film Resistors for

40731 | https://www.smta.org/smtai/SMTAI-2019-Technical-Program.pdf?v=200622100619

Surface Mount Technology Association (SMTA)

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