| https://www.eptac.com/webinars/gold-embrittlement-when-gold-removal-is-a-must/
Gold Embrittlement: When Gold Removal is a Must - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
| https://www.eptac.com/webinars/gold-embrittlement-when-gold-removal-is-a-must
Gold Embrittlement: When Gold Removal is a Must - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
| https://www.eptac.com/blog/j-std-001-revision-changes-regarding-the-requirements-for-gold-plating-removal
. Gold embrittlement is not a visually inspectable anomaly. In cases where analysis has determined there is a gold embrittlement condition, the gold embrittlement shall be considered a defect, see IPC-HDBK-001 or IPC-AJ-820 handbook for guidance
| https://www.eptac.com/faqs/ask-helena-leo/ask/j-std-001e-2010-4-5-1-gold-removal-issues
? Have you experienced RF component manufacturers that only offer SMT components with gold finish before? Does the concern of gold embrittlement take into account how much solder paste is being deposited in a surface mount solder joint? Answer
| https://www.eptac.com/j-std-001-revision-changes-regarding-the-requirements-for-gold-plating-removal/
. Gold embrittlement is not a visually inspectable anomaly. In cases where analysis has determined there is a gold embrittlement condition, the gold embrittlement shall be considered a defect, see IPC-HDBK-001 or IPC-AJ-820 handbook for guidance
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5255
) when the solder gold content exceeds 5% by weight. Controlling the component gold plating thickness as well as the soldering process temperature and time can prevent gold embrittlement
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