| https://www.eptac.com/blog/j-std-001-revision-changes-regarding-the-requirements-for-gold-plating-removal
J-STD-001 Revision Changes Regarding The Requirements for Gold Plating Removal Looking for solder training standards, manuals, kits, and more
| https://www.eptac.com/ask/failing-to-remove-gold-plating-in-final-assembly/
Failing to Remove Gold Plating in Final Assembly - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
| https://www.eptac.com/faqs/ask-helena-leo/ask/failing-to-remove-gold-plating-in-final-assembly
Failing to Remove Gold Plating in Final Assembly - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
| https://www.eptac.com/j-std-001-revision-changes-regarding-the-requirements-for-gold-plating-removal/
J-STD-001 Revision Changes Regarding The Requirements for Gold Plating Removal - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
| https://www.eptac.com/webinar/gold-embrittlement-when-gold-removal-is-a-must/
: When Gold Removal is a Must We hear/are asked this question all the time. When do I need to remove gold plating and why do I have too
| https://www.eptac.com/webinars/gold-embrittlement-when-gold-removal-is-a-must/
. When do I need to remove gold plating and why do I have too? Give us a moment to explain this issue, why it is required, when it is necessary and how removal is usually performed
| https://www.eptac.com/webinars/gold-embrittlement-when-gold-removal-is-a-must
: When Gold Removal is a Must We hear/are asked this question all the time. When do I need to remove gold plating and why do I have too
| https://www.eptac.com/ask/gold-wire-bond-failing-pull-test/
: We have a situation where we have gold boards which accept gold wire bonding, but are failing a pull test. Other than making sure the boards are clean with a quick trip into the degreaser, is there any other way to refresh gold plating to help these boards pass pull testing
| https://www.eptac.com/faqs/ask-helena-leo/ask/gold-wire-bond-failing-pull-test
: We have a situation where we have gold boards which accept gold wire bonding, but are failing a pull test. Other than making sure the boards are clean with a quick trip into the degreaser, is there any other way to refresh gold plating to help these boards pass pull testing? Answer
| https://www.eptac.com/soldertips/soldertips-gold-removal-and-wave-soldering-vs-hand-soldering/
2.54 micrometers or 100 micro-inches (.00001”) and from all components which will be hand soldered, regardless of gold thickness. The double tinning process is for tinning the components prior to soldering them, and the need is to dip those components in the solder pot twice to remove the gold plating
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