| https://www.eptac.com/soldertips/soldertips-gold-removal-and-wave-soldering-vs-hand-soldering/
. There is enough solder in the solder pot to keep the gold concentrations low, so we don’t have to worry about high levels of gold contamination in the solder pot
| https://www.eptac.com/webinars/the-need-for-gold-removal-on-solderable-surfaces/
. Topics we will be reviewing are: The history of the process. Review of J-STD-001 Section 4.5.1 requirements. Solder joint and solder pot gold contamination
| https://www.eptac.com/webinars/the-need-for-gold-removal-on-solderable-surfaces
. Topics we will be reviewing are: The history of the process. Review of J-STD-001 Section 4.5.1 requirements. Solder joint and solder pot gold contamination
| https://www.eptac.com/faqs/soldertips/soldertip/soldertips-gold-removal-and-wave-soldering-vs-hand-soldering
. There is enough solder in the solder pot to keep the gold concentrations low, so we don’t have to worry about high levels of gold contamination in the solder pot
| https://www.eptac.com/faqs/ask-helena-leo/page/8
... Read More Excess Flux Causing Intermittent Connection Issues QUESTION Question: We are having an issue with the cleanliness of flux
| https://www.eptac.com/faqs/ask-helena-leo/ask/solder-selection-for-printed-circuit-boards-and-terminals
? My second question is what kind of solder would you suggest for doing repair or adding a component to a surface mount board? Answer: The type of flux to be used is determined by the surfaces being soldered, such as HASL, OSP, ENIG, Gold, Pd, etc
| https://www.eptac.com/faqs/ask-helena-leo/page/5
? Read More Dip Tinning Conductors with Low Temperature Insulation and Solder Pot Contamination QUESTION Question: We have an application that due to the type of stranded conductor being used, it may be necessary to semi-strip the insulation, flux and dip the conductor with the insulation slug still in place to
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Optimizing-Reflowed-Solder-TIM-sTIMs-Processes-for-Emerging-Heterogeneous.pdf
, June 2006 [8] Conseil et al., “Contamination profile of Printed Circuit Board Assemblies in relation to soldering types and conformal coating”, Proc. EuroCorr 2014 [9] Piao and McIntyre, “Adventitious carbon growth on aluminium and gold–aluminium alloy
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-glossary-of-terms
Lubrication Systems Mixers Pest Control Systems Reservoirs and Pumps Solder Paste and Flux Syringe Barrels and Cartridges Thermal Compounds (TIM) Two-Component (2k
| https://www.eptac.com/soldertips/solder-pot-maintenance-and-dross-removal/
: Solder Contacting Component Bodies Issues of Burnt Flux on Class 3 PCB Assemblies Gold Removal Issues with Hollow Cup Connectors Acceptability of Conformal Coating Bubbles Search Looking for Training Products? SolderTraining.com can help
