| https://www.eptac.com/faqs/ask-helena-leo/ask/gold-wire-bond-failing-pull-test
Gold Wire Bond Failing Pull Test - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
| https://www.eptac.com/faqs/ask-helena-leo/ask/failing-to-remove-gold-plating-in-final-assembly
. So if there is gold on the vias, it is not a defect. More SolderTips Visual Acuity Requirements for Soldering PEM® Nut Soldering Criteria Solder Flow Near Through-Hole Component Body Maximum Limits of Solder Bath Contamination Defining Standard Industry Practices for Torque of Threaded Fasteners Have a question
| https://www.eptac.com/faqs/ask-helena-leo/ask/gold-removal-on-bottom-only-smt-rf-components
Gold Removal on Bottom Only SMT RF Components - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
| https://www.eptac.com/faqs/ask-helena-leo/ask/j-std-001e-2010-4-5-1-gold-removal-issues
J-STD-001E-2010: 4.5.1, Gold Removal Issues - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
| https://www.eptac.com/faqs/ask-helena-leo/ask/j-std-001f-4-5-1-gold-removal-class-2-requirement-changed
J-STD-001F 4.5.1 Gold Removal Class 2 Requirement Changed - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
| https://www.eptac.com/faqs/ask-helena-leo/ask/what-is-the-correct-way-to-fill-solder-cups
. According to J-STD-001, 4.5.1 Gold Removal From at least 96& of the surfaces to be soldered of the through hole component leads with 2.54 um [100uin.} or more of gold thickness
| https://www.eptac.com/faqs/soldertips/soldertip/soldertips-issues-with-incomplete-solder-reflow-in-production-2
: Issues With Incomplete Solder Reflow in Production Question: We have some PCB assemblies that show incomplete solder flow due to signs of flux exhaustion. Question
| https://www.eptac.com/faqs/ask-helena-leo/ask/visual-acuity-requirements-for-soldering
® Nut Soldering Criteria Solder Flow Near Through-Hole Component Body Maximum Limits of Solder Bath Contamination Defining Standard Industry Practices for Torque of Threaded Fasteners J-STD-001F
| https://www.eptac.com/faqs/soldertips?hsLang=en
. Read More Gold Removal Issues with Hollow Cup Connectors General Tip Question: We are having a hard time with the removal of gold from hollow cup connectors
| https://www.eptac.com/faqs/soldertips
. Read More Gold Removal Issues with Hollow Cup Connectors General Tip Question: We are having a hard time with the removal of gold from hollow cup connectors
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