| https://www.eptac.com/webinars/gold-embrittlement-when-gold-removal-is-a-must
IPC’s J-STD-001, with guidance from the 001 handbook IPC-HDBK-001 and the Assembly and Joining handbook IPC-AJ-820. Join us for a few minutes, and as always, bring your questions about gold removal requirements and we will do our best to guide you through this issue
| https://www.eptac.com/webinars/gold-embrittlement-when-gold-removal-is-a-must/
. When do I need to remove gold plating and why do I have too? Give us a moment to explain this issue, why it is required, when it is necessary and how removal is usually performed
| https://www.eptac.com/ask/gold-wire-bond-failing-pull-test/
Gold Wire Bond Failing Pull Test - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
| https://www.eptac.com/blog/j-std-001-revision-changes-regarding-the-requirements-for-gold-plating-removal
://www.indium.com/blog/intermetallics-in-soldering.php There are many articles and papers that have been presented on the whole gold plating issue since its introduction into the manufacturing process on printed circuit boards and in the plating on the component leads
| https://www.eptac.com/ask/failing-to-remove-gold-plating-in-final-assembly/
. So if there is gold on the vias, it is not a defect. Have a technical question? Dealing with a process or standards issue and not sure where to turn
| https://www.eptac.com/j-std-001-revision-changes-regarding-the-requirements-for-gold-plating-removal/
://www.indium.com/blog/intermetallics-in-soldering.php There are many articles and papers that have been presented on the whole gold plating issue since its introduction into the manufacturing process on printed circuit boards and in the plating on the component leads
| https://www.eptac.com/ask/j-std-001f-4-5-1-gold-removal-class-2-requirement-changed/
J-STD-001F 4.5.1 Gold Removal Class 2 Requirement Changed - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
| https://www.eptac.com/faqs/soldertips/soldertip/soldertip-42-request-for-eptac-webinar-topics
: Request for EPTAC Webinar Topics Question: Do you have a topic or issue you would like us to discuss in an upcoming webinar? Answer: If the answer is yes, then we need you to send us an email
| https://www.eptac.com/faqs/ask-helena-leo/page/8
& Leo Have a technical question? Dealing with a process or standards issue and not sure where to turn? *Helena and Leo, our technical experts, are here to help
| https://www.eptac.com/webinars/page/4
creating that perfect solder joint every time. Learn More The Need for Gold Removal on Solderable Surfaces Length: 25 Minutes Gold removal from component solderable surfaces has, for many years, long been required, but do you really understand the value of, or why we go through this process
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