| https://www.eptac.com/webinars/tempered-leads-class-3-rework-toe-fillets-and-more/
Tempered Leads, Class 3 Rework, Toe Fillets and More - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
| https://www.eptac.com/webinars/tempered-leads-class-3-rework-toe-fillets-and-more
Tempered Leads, Class 3 Rework, Toe Fillets and More - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
| https://www.eptac.com/soldertips/soldertips-gold-removal-and-wave-soldering-vs-hand-soldering/
4.5.1 Gold Removal in J-STD-001 as you had mentioned. The gold has to be removed from component leads whose gold thickness exceeds
| https://www.eptac.com/blog/j-std-001-revision-changes-regarding-the-requirements-for-gold-plating-removal
. J-STD-001 Revision “E” stated: 4.5.1 Gold Removal Gold shall be removed: a. From at least 95% of the surfaces to be soldered of the through-hole component leads with 2.54 μm [100 μin
| https://www.eptac.com/faqs/ask-helena-leo/ask/failing-to-remove-gold-plating-in-final-assembly
. There is no requirement to remove this gold plating prior to soldering. The only requirement for the removal of gold is for component leads and terminals which will be soldered to the printed circuit board itself
| https://www.eptac.com/ask/failing-to-remove-gold-plating-in-final-assembly/
. There is no requirement to remove this gold plating prior to soldering. The only requirement for the removal of gold is for component leads and terminals which will be soldered to the printed circuit board itself
| https://www.eptac.com/faqs/ask-helena-leo/ask/j-std-001e-2010-4-5-1-gold-removal-issues
? Does this mean we should remove the ICs from their tape and reel packaging, tin the leads for proper gold removal, then re-reel the parts for proper packaging for pick and place equipment
| https://www.eptac.com/soldertip/soldertips-gold-removal-and-wave-soldering-vs-hand-soldering/
: Soldering gold parts onto printed circuit boards follows Paragraph 4.5.1 Gold Removal in J-STD-001 as you had mentioned. The gold has to be removed from component leads whose gold thickness exceeds
| https://www.eptac.com/faqs/soldertips/soldertip/soldertips-gold-removal-and-wave-soldering-vs-hand-soldering
: Soldering gold parts onto printed circuit boards follows Paragraph 4.5.1 Gold Removal in J-STD-001 as you had mentioned. The gold has to be removed from component leads whose gold thickness exceeds
| https://www.eptac.com/j-std-001-revision-changes-regarding-the-requirements-for-gold-plating-removal/
. J-STD-001 Revision “E” stated: 4.5.1 Gold Removal Gold shall be removed: a. From at least 95% of the surfaces to be soldered of the through-hole component leads with 2.54 μm [100 μin
