| https://www.eptac.com/ask/gold-wire-bond-failing-pull-test/
? Does it have a Nickel underplate? How thick is the gold plating? I’ve checked Mil-Std-883F method 2011.7 Bond Strength (Destructive Bond Pull Test
| https://www.eptac.com/blog/j-std-001-revision-changes-regarding-the-requirements-for-gold-plating-removal
. Because of this, the gold has to be completely removed so that the solder makes the electromechanical and/or metallurgical bond to the subsurface beneath the gold, which in most cases is Nickel
| https://www.eptac.com/faqs/ask-helena-leo/ask/j-std-001f-4-5-1-gold-removal-class-2-requirement-changed
)? Connectors and surface mount oscillators are only available in Gold over Nickel... Question: Why did the IPC make the gold removal requirement for Class 2 products a requirement (D2D3
| https://www.eptac.com/ask/j-std-001f-4-5-1-gold-removal-class-2-requirement-changed/
)? Connectors and surface mount oscillators are only available in Gold over Nickel terminations and are difficult to tin and re-package. Answer: The reasoning for the change was due to the failures happening in the field with these types of components
| https://www.eptac.com/j-std-001-revision-changes-regarding-the-requirements-for-gold-plating-removal/
. Because of this, the gold has to be completely removed so that the solder makes the electromechanical and/or metallurgical bond to the subsurface beneath the gold, which in most cases is Nickel
| https://www.eptac.com/soldertips/soldertips-solderability-issues-with-nickle-plated-surfaces/
: Solderability Issues with Nickle Plated Surfaces Question: We are working with components with leads of tin/lead over nickel. After the manufacturing processes, some of the pins are exhibiting what appears to be flaking plating, leaving behind unsolderable surfaces
| https://www.eptac.com/faqs/soldertips/soldertip/soldertips-solderability-issues-with-nickle-plated-surfaces
: Solderability Issues with Nickle Plated Surfaces Question: We are working with components with leads of tin/lead over nickel. After the manufacturing processes, some of the pins are exhibiting what appears to be flaking plating, leaving behind unsolderable surfaces
Imagineering, Inc. | https://www.pcbnet.com/blog/everything-you-need-to-know-about-pcb-finish/
: nickel and gold, and hot air solder leveling (HASL). Today, dozens of options for PCB finishes are available, each with their own benefits for different applications
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5255
today’s lead-free soldering applications. A series of soldering dissolution experiments, modeled on Bader’s, were conducted using SAC305 solder with gold, silver, palladium, platinum, copper and nickel samples
