GPD Global | https://www.gpd-global.com/fluid-dispense-adhesive-application.php
Conductive Adhesive & Non-Conductive Adhesive Dispensing Home Products Fluid Dispensing Equipment High Precision Dispenser -MAX Series Large Format Board Dispensing -DS Series Table Top Dispensing Equipment Loader
GPD Global | https://www.gpd-global.com/dispensing-conductive-adhesive.php
Conductive Adhesive & Non-Conductive Adhesive Dispensing Home Products Fluid Dispensing Equipment High Precision Dispenser - MAX Series Large Format Board Dispensing - DS Series Table Top Dispensing Equipment Loader
| http://etasmt.com/cc?ID=te_news_news,26368&url=_print
I.C.T ROUTER GOLD-Trade Info-Reflow oven,SMT Reflow Soldering Oven-cmsadmin Reflow oven,SMT Reflow Soldering Oven 当前位置: Home >> News >> Trade Info I.C.T ROUTER GOLD I.C.T ROUTER GOLD This machine is required at the final stage of SMT line to cut a Panel into Modules
| http://etasmt.com:9060/te_news_news/2021-09-07/26368.chtml
I.C.T ROUTER GOLD-Trade Info-Reflow oven,SMT Reflow Soldering Oven-cmsadmin Home About I.C.T News Products Video Projects Service Join Us Contact Us Home About I.C.T
| http://etasmt.com/te_news_news/2021-09-07/26368.chtml
I.C.T ROUTER GOLD-Trade Info-Reflow oven,SMT Reflow Soldering Oven-cmsadmin Home About I.C.T News Products Video Projects Service Join Us Contact Us Home About I.C.T
Imagineering, Inc. | https://www.pcbnet.com/capabilities/assembly/technology-roadmap/
(HDI) Finish Hole Size • Mechanical Drill - 4 mil (HDI) • Laser Drill - 2.5 mil (HDI) True Hole Position +/-.0015" Finish Hole Size Tolerance • PTH - +/-.0015" • Non-PTH - +/-.001" Aspect Ratio (Board Tks./FHS) 30 Heavy Copper
Imagineering, Inc. | https://www.pcbnet.com/capabilities/fabrication/technology-roadmap/
(HDI) Finish Hole Size • Mechanical Drill - 4 mil (HDI) • Laser Drill - 2.5 mil (HDI) True Hole Position +/-.0015" Finish Hole Size Tolerance • PTH - +/-.0015" • Non-PTH - +/-.001" Aspect Ratio (Board Tks./FHS) 30 Heavy Copper
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/products/solder-paste/fluxplus-paste-flux
27P00 45P00 Aluminum Non-solderable Beryllium Copper Brass Bronze Cadmium Chromium Non-solderable Copper Galvanized Steel Gold Kovar Magnesium Non-solderable Mild Steel Monel Nichrome Nickel Nickel
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types-2020/cavity-shear
. The typical deformation of gold balls is shown in pictures below. These bonds were non-destructively tested to the mean bond strength, so that the ball is deformed but the bond did not fully fail
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/1058-lead-delaminations
. Tinning is sometimes done with a noble metal such as gold to improve the adhesion of bond wires. The problem is that some molding compounds do not adhere well to the noble metals
