| https://www.eptac.com/faqs/ask-helena-leo/ask/maximum-limits-of-solder-bath-contamination
. For examples component coming in with Lead-free coating and need to be tin/lead coated, this is a preconditioning element, and the same applied if the tin plated components have to be changed to SAC
Imagineering, Inc. | https://www.pcbnet.com/quote/board-quote/?cpn=1
0.025" smallest hole 0.015", all Plated holes, smallest trace/space 0.007", Green LPI Mask, White Top Silkscreen, Individual board
Imagineering, Inc. | https://www.pcbnet.com/quote/board-quote/
0.015", all Plated holes, smallest trace/space 0.007", Green LPI Mask, White Top Silkscreen, Individual board with Single circuit design and No Multiple images of boards. File type: 274x required. No paint
| https://www.eptac.com/faqs/soldertips/soldertip/soldertip-39-class-2-vs-class-3-assemblies
. In IPC-A-610 some of the differences are found in component placement for surface mount components, hole fill requirements for plated through holes and cleanliness requirements based upon residual
| https://www.eptac.com/faqs/soldertips/soldertip/soldertips-defining-shear-forces-for-surface-mounted-components
? Answer: The IPC does not have any specification that discusses the strength or shear forces of solder or components mounted onto pads or into plated through holes
. Can you explain what the “standard industry practice” is? Read Answer J-STD-001F 4.5.1 Gold Removal Class 2 Requirement Changed Question
Imagineering, Inc. | https://www.pcbnet.com/quote/board-quote-china/?cpn=1
. Specs: FR4, 2 & 4 layers, max.60 sqin., max. 14in length, 0.062",1 Oz Cu., Smt pitch minimum 0.025" smallest hole 0.015", all Plated holes, smallest trace/space
| https://www.eptac.com/soldertips/solder-paste-shelf-life-and-testing/
. The other issue with solder paste is the function of the flux. In plated through hole soldering the flux is used to prepare the component leads and the circuit board prior to soldering
| https://www.eptac.com/wp-content/uploads/2021/11/webinar_eptac_05_20_09.pdf
% 9 10 11 The 610 Hot Topics Addressed Hardware Cable fabrication Hardware sequence Plated Through Lead protrusion 12 Program Document Feedback
| https://www.eptac.com/solder-tips/
. Read Answer Gold Removal Issues with Hollow Cup Connectors Question: We are having a hard time with the removal of gold from hollow cup connectors
