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Which Soldering Defects are Related to the Incorrect Setup of the Reflow Profile?-SMT Technical-Reflow oven,SMT Reflow Soldering Oven-cmsadmin Home About
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Heller Industries Inc. | https://hellerindustries.com/bridging-defects/
. Process and design-related causes of PCB Bridging Defects: Excessive volume of solder due to improper pad dimension Excessive volume of solder due to improper stencil aperture Improper application of solder mask Excessive slump of solder paste Reflow-related causes
Heller Industries Inc. | https://hellerindustries.com/solder-balls-defects/
. Process and design-related causes of solder ball defects: Improper pad design Weak solder paste (for ambient con-ditions) Expired solder paste Misaligned print
Heller Industries Inc. | https://hellerindustries.com/solder-ball-defects/
. Process and design-related causes of solder ball defects: Improper pad design Weak solder paste (for ambient con-ditions) Expired solder paste Misaligned print
Heller Industries Inc. | https://hellerindustries.com/solder-balls-defects
. Process and design-related causes of solder ball defects: Improper pad design Weak solder paste (for ambient con-ditions) Expired solder paste Misaligned print
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/polymer-processing-systems/information/xaloy-solutions-for-splay-defects
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