| https://www.eptac.com/faqs/ask-helena-leo/ask/j-std-001e-2010-4-5-1-gold-removal-issues
: 4.5.1, Gold Removal Issues Question: Since we are seeing more and more components with gold finish on the solder attachment pads(specifically, leadless ICs mostly with bottom side terminations only for RF circuitry
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/march/about-us/news/nordson-march-research-evaluates-the-effects-of-rf-plasma-processing-prior-to-conformal-coating
(formerly known as Desich SMART Center). The paper can be downloaded here . The objective of the experiment was to evaluate the effects of RF plasma processing on the conformity of coverage of conformal coating of the knee of individual Nickel-Palladium-Gold (Ni-Pd-Au
| https://www.eptac.com/wp-content/uploads/2015/03/ecss_q_st_70_18c-space-product-assurance-rf-coax-cables.pdf
ECSS-Q-ST-70-18C ECSS-Q-ST-70-18C 15 November 2008 Space product assurance Preparation, assembly and mounting of RF coaxial cables
| https://www.eptac.com/faqs/ask-helena-leo/page/7
. According to everything (e.g.,.Data Sheets, mole profiles, oven... Read More Gold Removal on Bottom Only SMT RF Components QUESTION Question
| https://www.eptac.com/faqs/ask-helena-leo/page/8
... Read More J-STD-001E-2010: 4.5.1, Gold Removal Issues QUESTION Question: Since we are seeing more and more components with gold finish on the solder attachment pads
Imagineering, Inc. | https://www.pcbnet.com/blog/understanding-the-pcb-fabrication-process-from-design-to-delivery/
: FR-4 CEM-1 CEM-2 CEM-3 RF-35 PETE Polyimide Temperature of Glass-Transition A substrate’s response to temperature is one of the most important factors to consider when selecting a substrate since overheating is a common cause of PCB failure
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm
) and Gold Embrittlement Conditions David Hillman and Daphne Gates Abstract 32-3 Assessment of 2nd Level Interconnect Quality in Flip Chip Ball Grid Array (FCBGA
40731 | https://www.smta.org/smtai/SMTAI-2019-Technical-Program.pdf?v=200609010628
Surface Mount Technology Association (SMTA)
40731 | https://www.smta.org/smtai/SMTAI-2019-Technical-Program.pdf?v=200622100619
Surface Mount Technology Association (SMTA)
Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/best_papers.cfm
. Judy Glazer, Hewlett Packard, California "The Effect of Gold on the Reliability of Solder Joints" ^ Hide ^ "Best of Proceedings" Papers The following papers were selected by the SMTA International Technical Program Committee as the 2019 Best of Proceedings. 2019 1st Place
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