| https://www.eptac.com/webinars/gold-embrittlement-when-gold-removal-is-a-must/
Gold Embrittlement: When Gold Removal is a Must - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
| https://www.eptac.com/webinars/gold-embrittlement-when-gold-removal-is-a-must
Gold Embrittlement: When Gold Removal is a Must - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
Lewis & Clark | https://www.lewis-clark.com/product-tag/gold/
Gold Archives - Lewis and Clark, Inc. Skip to content My Cart: $ 0.00 0 View Cart Checkout No products in the cart. Subtotal: $ 0.00 View Cart Checkout Lewis and Clark, Inc
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-selection-guide
Solder Selection Guide Nordson EFD Corporate | Global Directory | Languages Division Only All of Nordson Home Products Accessories
Lewis & Clark | https://www.lewis-clark.com/product-tag/gold-plus/
Gold Plus Archives - Lewis and Clark, Inc. Skip to content My Cart: $ 0.00 0 View Cart Checkout No products in the cart. Subtotal: $ 0.00 View Cart Checkout Lewis and Clark, Inc
| https://www.eptac.com/soldertips/gold-removal-issues-with-hollow-cup-connectors/
: We are having a hard time with the removal of gold from hollow cup connectors. Using lead free solder, we are wicking the solder out with braid, but what is happening is that the pins are getting overheated and coming loose from the connector
| https://www.eptac.com/soldertips/soldertips-gold-removal-and-wave-soldering-vs-hand-soldering/
: “A double tinning process or dynamic solder wave may be used for gold removal prior to mounting the component on the assembly”. Does this mean that if we run a through-hole CCA thru a wave solder machine twice it would meet the gold removal requirements
Lewis & Clark | https://www.lewis-clark.com/product-tag/universal-gold-feeders/
universal gold feeders Archives - Lewis and Clark, Inc. Skip to content My Cart: $ 0.00 0 View Cart Checkout No products in the cart. Subtotal
| https://www.eptac.com/webinar/the-need-for-gold-removal-on-solderable-surfaces/
. Topics we will be reviewing are: The history of the process. Review of J-STD-001 Section 4.5.1 requirements. Solder joint and solder pot gold contamination
| https://www.eptac.com/blog/j-std-001-revision-changes-regarding-the-requirements-for-gold-plating-removal
J-STD-001 Revision Changes Regarding The Requirements for Gold Plating Removal Looking for solder training standards, manuals, kits, and more
