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. We repair surface mount pads, BGA pads, Gold Finger Contacts and other circuitry. Price may vary depending on quantity, type of pad and degree of damage
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. We repair Surface Mount Pads, BGA pads, Gold Finger Contacts and other circuitry including Circuit Modification. Price may vary depending on quantity, type of pad and degree of damage
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2.54 micrometers or 100 micro-inches (.00001”) and from all components which will be hand soldered, regardless of gold thickness. The double tinning process is for tinning the components prior to soldering them, and the need is to dip those components in the solder pot twice to remove the gold plating
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IPC Standards for Manufacturing & Assembly - PCB Libraries Forum Forum Home > PCB Library Expert > Questions & Answers New Posts FAQ Search Events Register Login IPC Standards for Manufacturing
Products, services, training & consulting for the assembly, rework & repair of electronic assemblies. BGA process experts. Manufacturers Rep, Distributor & Service Provider for Seamark/Zhuomao and Shuttle Star BGA Rework Stations.
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