| https://www.eptac.com/faqs/ask-helena-leo/ask/j-std-001e-2010-4-5-1-gold-removal-issues
? Have you experienced RF component manufacturers that only offer SMT components with gold finish before? Does the concern of gold embrittlement take into account how much solder paste is being deposited in a surface mount solder joint? Answer
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5255
. One example of how the interactions between solder and surface finish can affect solder joint integrity is the potential formation of brittle gold/tin intermetallic compounds (IMCs
Imagineering, Inc. | https://www.pcbnet.com/quote/board-quote-usa/?cpn=2
* Select One 1 2 3 4 5 6 8 Dimensions * Materials FR4(130Tg) FR4(170Tg) FR4(180Tg) from Taiwan or China Copper Weight 1 oz 2 oz 3 oz 4 oz Cu from Taiwan or China Finish Plating ENIG1U" (Immersion Gold) HASL (Leaded
Imagineering, Inc. | https://www.pcbnet.com/quote/board-quote-usa/?cpn=3
. PCB Specifications View Matrix Part Number * Revision Quantity * Thickness 0.062" Layers * Select One 2 4 6 8 Dimensions * Materials FR4(130Tg) FR4(180Tg) from Taiwan or China Copper Weight 1 oz 4 oz Cu from Taiwan or China Finish Plating HASL
| https://www.eptac.com/soldertips/soldertips-solderability-issues-with-nickle-plated-surfaces/
. They will re-tin with flux, but reappear following steam-aging. Is this something you have encountered before? Answer: There is a metallurgy issue with soldering to nickel plated surfaces and depending upon the thickness of the final tin/lead coating, the steam aging will penetrate the finish coating and create a
Imagineering, Inc. | https://www.pcbnet.com/quote/board-quote/
. PCB Specifications View Matrix Part Number * Revision Quantity * Thickness 0.062" Layers * Select One 2 4 6 8 Dimensions * Materials FR4(130Tg) Copper Weight 1 oz Finish Plating Leaded Solder Minimum Trace/Space
Imagineering, Inc. | https://www.pcbnet.com/quote/board-quote/?cpn=2
) Copper Weight 1 oz 2 oz 3 oz 4 oz Finish Plating HASL (Leaded) LF HASL Immersion Gold Immersion Silver White Tin OSP Minimum Trace/Space 0.005" 0.006" 0.007
| https://www.eptac.com/faqs/soldertips/soldertip/soldertips-solderability-issues-with-nickle-plated-surfaces
. They will re-tin with flux, but reappear following steam-aging. Is this something you have encountered before? Answer: There is a metallurgy issue with soldering to nickel plated surfaces and depending upon the thickness of the final tin/lead coating, the steam aging will penetrate the finish coating and create a
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Optimizing-Reflowed-Solder-TIM-sTIMs-Processes-for-Emerging-Heterogeneous.pdf
. On both sides of the joint, indium is anchored to nickel with a protective gold finish. Nickel forms a stable intermetallic bond with indium
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