| https://www.eptac.com/faqs/ask-helena-leo/ask/j-std-001e-2010-4-5-1-gold-removal-issues
? Does this mean we should remove the ICs from their tape and reel packaging, tin the leads for proper gold removal, then re-reel the parts for proper packaging for pick and place equipment
| https://www.eptac.com/soldertip/soldertips-gold-removal-and-wave-soldering-vs-hand-soldering/
”. Does this mean that if we run a through-hole CCA thru a wave solder machine twice it would meet the gold removal requirements? If not, how would we tin the gold plated components by wave soldering? Answer
| https://www.eptac.com/faqs/soldertips/soldertip/soldertips-gold-removal-and-wave-soldering-vs-hand-soldering
”. Does this mean that if we run a through-hole CCA thru a wave solder machine twice it would meet the gold removal requirements? If not, how would we tin the gold plated components by wave soldering? Answer
| https://www.eptac.com/blog/j-std-001-revision-changes-regarding-the-requirements-for-gold-plating-removal
. Although gold is a noble metal, the methodology for its application, be it electroplating or immersion plating, gold will still go into a molten tin/lead or tin solder solution
| https://www.eptac.com/faqs/ask-helena-leo/ask/j-std-001f-4-5-1-gold-removal-class-2-requirement-changed
) when in Rev E of J-STD-001 it was a process indicator (P2D3)? Connectors and surface mount oscillators are only available in Gold over Nickel terminations and are difficult to tin and re-package. Answer
| https://www.eptac.com/ask/j-std-001f-4-5-1-gold-removal-class-2-requirement-changed/
)? Connectors and surface mount oscillators are only available in Gold over Nickel terminations and are difficult to tin and re-package. Answer: The reasoning for the change was due to the failures happening in the field with these types of components
| https://www.eptac.com/j-std-001-revision-changes-regarding-the-requirements-for-gold-plating-removal/
. Although gold is a noble metal, the methodology for its application, be it electroplating or immersion plating, gold will still go into a molten tin/lead or tin solder solution
Imagineering, Inc. | https://www.pcbnet.com/capabilities/assembly/technology-roadmap/
• Inner Layer - 10 oz • Inner Layer - 16 oz Buried/Blind Via 10+N+10 (HDI) Plasma Desmear Yes Outline Tolerance +/-.004 Surface Finish • HASL • ENIG • Immersion Silver • OSP (ENTEK) • Carbon • Immersion Tin • Electrolyic Gold • ENEPIG • ENIPIG Impeadance Control
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