| https://www.eptac.com/soldertips/problems-with-stress-cracks-in-ceramic-components/
. Although it may not be seen at this time, the ceramic will fracture when exposed to heat cycles. Solder paste, Tin/Lead or Lead-Free. Lead-Free is more brittle and the stress relief will be absorbed by the component causing it to crack
| https://www.eptac.com/soldertips/solder-pot-maintenance-and-dross-removal/
. As a quick note, solder dross does not build up too quickly in a static pot, so there is enough time to tin after cleaning off the oxides (dross
| https://www.eptac.com/solder-tips/
. Read Answer Gold Removal Issues with Hollow Cup Connectors Question: We are having a hard time with the removal of gold from hollow cup connectors
| https://www.eptac.com/faqs/soldertips/soldertip/soldertips-problems-with-stress-cracks-in-ceramic-components
. Although it may not be seen at this time, the ceramic will fracture when exposed to heat cycles. Solder paste, Tin/Lead or Lead-Free. Lead-Free is more brittle and the stress relief will be absorbed by the component causing it to crack
Imagineering, Inc. | https://www.pcbnet.com/blog/understanding-the-pcb-fabrication-process-from-design-to-delivery/
. For example, electroless nickel immersion gold (ENIG) is a common surface finish due to its long shelf life and RoHS compliance . However, it’s more expensive than other options
| https://www.eptac.com/faqs/soldertips/soldertip/solder-pot-maintenance-and-dross-removal
. As a quick note, solder dross does not build up too quickly in a static pot, so there is enough time to tin after cleaning off the oxides (dross
Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/best_papers.cfm
: Hersh Kohli, Motorola, Illinois "E-Manufacturing Software for Product and Process Real-Time Monitoring" 2000: Andrew Mawer, Motorola SPS, Texas "Automotive PBGA Assembly and Board-Level Reliability with Lead-Free Versus Lead-Tin Interconnect" 1999
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/products/solder-paste/fluxplus-paste-flux
27P00 45P00 Aluminum Non-solderable Beryllium Copper Brass Bronze Cadmium Chromium Non-solderable Copper Galvanized Steel Gold Kovar Magnesium Non-solderable Mild Steel Monel Nichrome Nickel Nickel
Surface Mount Technology Association (SMTA) | https://www.smta.org/hutchins/hutchins.cfm
? Chemical Engineer, Honeywell FM&T 2016 Thomas Reeve , Purdue University Paper: "Heterogeneous Nucleation of ß-Tin in Lead-Free, Tin-Based Solder Alloys" Where is he now
