| https://www.eptac.com/ask/what-is-the-correct-way-to-fill-solder-cups/
. From 95% of all surfaces to be soldered of surface mount components regardless of gold thickness. From the surfaces to be soldered of solder terminals plated with 2.54um [100uin
| https://www.eptac.com/faqs/soldertips/soldertip/soldertip-37-through-hole-soldering-of-thick-pcbs
. Solder iron temperature, solder iron heat capacity, preheating of the board, are all issues which need to be considered when trying to fill these types of plated through holes
| https://www.eptac.com/soldertips/soldertip-47-how-long-does-it-take-to-make-a-solder-joint/
. For example a surface mount component would take less time to solder than a plated through hole, since a plated through hole has more metal to heat up
Imagineering, Inc. | https://www.pcbnet.com/specials/offer-1/
0.025″ smallest hole 0.015″, all Plated holes, smallest trace/space 0.007″, Green LPI Mask, White Top Silkscreen, Individual board
Imagineering, Inc. | https://www.pcbnet.com/quote/board-quote-usa/?cpn=1
. Specs: FR4, 2 & 4 layers, max.60 sqin., max. 14in length, 0.062",1 Oz Cu., Smt pitch minimum 0.025" smallest hole 0.015", all Plated holes, smallest trace/space
Imagineering, Inc. | https://www.pcbnet.com/quote/board-quote-usa/?cpn=3
0.025", smallest hole 0.015", all Plated holes, smallest trace/space 0.007", Green LPI Mask, White Top Silkscreen, Individual board with Single circuit design and No Multiple images of boards. File type: 274x required. No paint
| https://www.eptac.com/faqs/soldertips?hsLang=en
. Read More Gold Removal Issues with Hollow Cup Connectors General Tip Question: We are having a hard time with the removal of gold from hollow cup connectors
| https://www.eptac.com/faqs/soldertips
. Read More Gold Removal Issues with Hollow Cup Connectors General Tip Question: We are having a hard time with the removal of gold from hollow cup connectors
| https://www.eptac.com/faqs/soldertips/soldertip/soldertip-47-how-long-does-it-take-to-make-a-solder-joint
. For example a surface mount component would take less time to solder than a plated through hole, since a plated through hole has more metal to heat up
| https://www.eptac.com/soldertips/defining-shear-forces-for-surface-mounted-components/
: The IPC does not have any specification that discusses the strength or shear forces of solder or components mounted onto pads or into plated through holes
