| https://www.eptac.com/j-std-001-revision-changes-regarding-the-requirements-for-gold-plating-removal/
. Gold embrittlement is not a visually inspectable anomaly. In cases where analysis has determined there is a gold embrittlement condition, the gold embrittlement shall be considered a defect, see IPC-HDBK-001 or IPC-AJ-820 handbook for guidance
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5255
. One example of how the interactions between solder and surface finish can affect solder joint integrity is the potential formation of brittle gold/tin intermetallic compounds (IMCs
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm
Brian Gray, P.Eng. Abstract 24-3 Tin Whisker Testing and Risk Modeling Project Stephan Meschter, Steve McKeown, Polina Snugovsky, Jeff Kennedy, and Eva Kosiba Abstract 24-3 Case Histories in Failure Analysis of Electronics Assemblies Vladimir Igoshev
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/last-will-of-bga-void-1.pdf
. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys
Surface Mount Technology Association (SMTA) | https://www.smta.org/hutchins/hutchins.cfm
? Chemical Engineer, Honeywell FM&T 2016 Thomas Reeve , Purdue University Paper: "Heterogeneous Nucleation of ß-Tin in Lead-Free, Tin-Based Solder Alloys" Where is he now
.gif)
winsouce.jpg)